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Semi. Global Sourcing Provider

As an innovative supplier, we are committed to providing high-quality, cost-saving semiconductor equipment, materials and consumable through collaboration with customers and global partners.

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EQUIPMENT

Semi. Equipment (New)

RTP (1 Chamber / 2 Chamber)

6" & 8" Conversion  |  SoD : Si, SiC, GaN

Crystal X-Ray Orientation

Wafer Bonder

Semiconductor Used Tool

As-Is & Refurbishment, Overhaul

Solution Provider & Consulting

Wafer Manufacturing Front-End Tool
CVD / PVD Applied Materials
Lithography ASML / Nikon / Canon
Etch & Asher LAM Research / PSK
CMP AMAT / Ebara
Laser ESI / MKS
Metrology KLA Tencor / Hitachi

Equipment – Laser Repair

Laser repair system designed to improve yields in advanced memory devices such as DRAM, SRAM, and embedded memory
Feature ESI 9830 (HDE) ESI 9850 (TPIR) GSI M450 GSI M550
Primary Use ✓ DRAM/SRAM/Flash fuse cutting (repair)
✓ 90nm~50nm memory & Outsourcing Test company (12inch)
Laser Single-beam Dual-beam Single-beam Dual-beam
Comparison Global Standard Fastest throughput Equivalent to ESI 9830 but slower Throughput between 9830~9850
Priority High Medium Low Low

Equipment – Hybrid Bonder

NVIDIA (Blackwell), TSMC (CoWoS), and SK Hynix (HBM4)
They all apply hybrid bonding technology to their core manufacturing processes.

HBM / CoWoS Packing

Hybrid Bonder evolution & CoWoS packaging roadmap

3D NAND

EVG H Hybrid Bonder (TNTC)
Export to Samsung, SK Hynix, and Kioxia

Next Generation DRAM

Samsung, SK Hynix R&D
W2W Hybrid Bonding structure

Photos

CVD / Etch