Semi. Global Sourcing Provider
As an innovative supplier, we are committed to providing high-quality, cost-saving semiconductor equipment, materials and consumable through collaboration with customers and global partners.
6" & 8" Conversion | SoD : Si, SiC, GaN
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| Wafer Manufacturing Front-End Tool | |
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| CVD / PVD | Applied Materials |
| Lithography | ASML / Nikon / Canon |
| Etch & Asher | LAM Research / PSK |
| CMP | AMAT / Ebara |
| Laser | ESI / MKS |
| Metrology | KLA Tencor / Hitachi |
| Feature | ESI 9830 (HDE) | ESI 9850 (TPIR) | GSI M450 | GSI M550 |
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| Primary Use |
✓ DRAM/SRAM/Flash fuse cutting (repair) ✓ 90nm~50nm memory & Outsourcing Test company (12inch) |
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| Laser | Single-beam | Dual-beam | Single-beam | Dual-beam |
| Comparison | Global Standard | Fastest throughput | Equivalent to ESI 9830 but slower | Throughput between 9830~9850 |
| Priority | High | Medium | Low | Low |
Hybrid Bonder evolution & CoWoS packaging roadmap
EVG H Hybrid Bonder (TNTC)
Export to Samsung, SK Hynix, and Kioxia
Samsung, SK Hynix R&D
W2W Hybrid Bonding structure
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