Semi. Global Sourcing Provider

As an innovative supplier, we are committed to providing high-quality, cost-saving semiconductor equipment, materials and consumable through collaboration with customers and global partners.

HOME > Business > Equipment

EQUIPMENT

Semi. Equipment (New)

RTP (1 Chamber / 2 Chamber)

6”& 8” Conversion, Sub : Si,SiC,GaN

Crystal X-Ray Orientation

Wafer Bonder

Semiconductor Used Tool

As-Is & Refurbishment, Overhaul

Solution Provider & Consulting

Wafer Manufacturing Front-End Tool
CVD / PVD	Applied Materials
Lithography	ASML / Nikon / Canon
Track	TEL
Etch & Asher	LAM Research / PSK
CMP	AMAT / Ebara
Laser	ESI / MKS
Metrology	KLA Tencor / Hitachi

Photos

CVD/Etch

Hybrid Bonder

Q. What do NVIDIA (Blackwell) – TSMC (CoWoS) – SK Hynix (HBM4) have in common?
A. Applying hybrid bonding technology to all core manufacturing processes